Sensor intermediate part, sensor and sensor manufacturing method

ABSTRACT

A sensor intermediate part is provided with a physical quantity detection element that has a power source terminal, a ground terminal and an output terminal that outputs a desired output signal, where the physical quantity detection element is capable of adjusting properties of the output signal; a high-capacitance capacitor, which has at least a first terminal and a second terminal, and a jumper wire, one end of which is conducted to either the power source terminal or the second terminal and the other end of which is not conducted. The first terminal is conducted to the ground terminal, and the power source terminal and the second terminal are configured to be electrically connectable by the jumper wire.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is based on Japanese Patent Application No.2017-241484 filed on Dec. 18, 2017, the disclosure of which isincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a sensor intermediate part, a sensorand a sensor manufacturing method.

BACKGROUND OF THE INVENTION

Conventionally, for example, as an electric current sensor used forcontrolling the input and output current of a battery such as hybridelectric vehicle (HEV) or an electric vehicle (EV) or the like, anelectric current sensor that uses a magnetic detection element such as aHall IC to measure input and output electric current flowing in aconductor such as a bus bar or the like connected to a battery has beenknown. In addition, as a Hall IC used for an electric current sensor, aprogrammable Hall IC or the like whose properties such as magneticsensitivity (output voltage) or zero magnetic field voltage or the like(below, these are at times collectively referred to as “output signals”)can be adjusted has been known. EEPROM (Electrically ErasableProgrammable Read-Only Memory) is incorporated in the programmable HallICs, and parameters that determine the properties of the output signalsare stored in this EEPROM. Adjustment of the properties of the outputsignals is performed by newly inputting (writing) the adjustmentparameter into the EEPROM, or rewriting the parameter stored in advancein the EEPROM.

PRIOR ART Patent Literature [PATENT LITERATURE 1] JP Laid-Open PatentApplication No. 2014-85240 SUMMARY OF THE INVENTION Problem to be Solvedby the Invention

In an electric current sensor that uses a magnetic detection elementsuch as a Hall IC or the like, it is difficult to avoid the occurrenceof variance in the magnetic permeability of the magnetic core or theposition and size of the magnetic circuit (for example, the magneticcore or the like). Consequently, even if the attempt is made to assemblean electric current sensor using magnetic detection elements such asHall ICs or the like in which the properties of the output signals havebeen adjusted in advance, in many cases the properties of the outputsignals from the magnetic detection element in the electric currentsensor after assembly are not within the desired error range. Hence, inorder to obtain the desired output signals even after the electriccurrent sensor is assembled, it is desirable to adjust the properties ofthe output signals in the intermediate parts (at times also referred toas “semi-finished products”) in which the various parts configuring theelectric current sensor are assembled to a certain extent.

However, to cause stable operation in the various kinds of sensors evenwhen the power source voltage changes intermittently due to outsidefactors, a high-capacitance capacitor may be provided between the powersource terminal and the ground terminal. On the other hand, whenadjusting the properties of the output signals of the electric currentsensor that uses Hall ICs, the write signal (programming signal) and thesynchronization signal at the time of programming or the like may beinput from the power source terminal of the Hall ICs as theabove-described adjustment parameters. In such cases, when theaforementioned write signals or synchronization signals or the like areinput from the power source terminal while the capacitor conducts withthe power source terminal, the signal waveform thereof is deformed bythe effects of the capacitor, and it may be difficult to adjust theproperties of the output signals.

Hence, it is an object of the present invention to provide a sensorintermediate part in which the properties of the output signals can bestably adjusted without being affected by the capacitor, a sensorcapable of outputting signals with stable properties, and a method ofmanufacturing such.

Means for Solving the Problem

In order to resolve the above problems, the present invention provides asensor intermediate part that includes a physical quantity detectionelement that has a power source terminal, a ground terminal and anoutput terminal, which outputs a desired output signal, where thephysical quantity detection element is capable of adjusting theproperties of the output signal; a high-capacitance capacitor, which hasat least a first terminal and a second terminal; and a jumper wire, oneend of which is conducted to either the power source terminal or thesecond terminal and the other end of which is not conducted. The firstterminal is conducted to the ground terminal, and the power sourceterminal and the second terminal are configured to be electricallyconnectable by the jumper wire.

Preferably, the above-described sensor intermediate part furtherincludes a circuit board having a first surface and a second surface,which is opposite to the first surface. The physical quantity detectionelement and the capacitor are arranged on the first surface of thecircuit board. A first through hole and a second through hole, whichpenetrate in the thickness direction of the circuit board, are formedwith a prescribed spacing in the circuit board. A first pad, which canbe conducted to one of the power source terminal and the secondterminal, is arranged at the periphery of the opening of the firstthrough hole on the first surface, and a second pad, which can beconducted to the other of the power source terminal and the secondterminal, is arranged at the periphery of the opening of the secondthrough hole on the second surface. One end of the jumper wire, which isroughly U-shaped, is inserted into the first through hole, and the oneend of the jumper wire is electrically connected to the first pad on thefirst surface. The other end of the jumper wire is inserted into thesecond though hole, and the other end of the jumper wire is notelectrically connected to the second pad on the second surface.

Preferably, in the above-described sensor intermediate part, the secondpad is provided at a position separated in the radial direction from theopening periphery of the second through hole on the second surface.Preferably, the above-described sensor intermediate part furtherincludes a housing that holds the circuit board. The housing includes afirst housing and a second housing that covers an opening of the firsthousing. The second through hole is formed in the circuit board suchthat at least the second pad exists at a position close to the openingof the first housing or protruding from the opening when the circuitboard is held in the first housing. The above-described capacitorpreferably has a capacitance of 1 μF or more.

In addition, the present invention provides a sensor in which the powersource terminal and the second terminal of the above-described sensorintermediate part are electrically connected by the jumper wire.

In addition, the present invention provides sensor manufacturing methodthat includes: a preparation step in which a circuit board is preparedon which are mounted a physical quantity detection element, which has apower source terminal, a ground terminal and an output terminal, whichoutputs a desired output signal. The properties of the output signal areadjustable. A capacitor, which has at least a first terminal and asecond terminal is also mounted on the circuit board. One end of thejumper wire is conducted to one of the power source terminal and thesecond terminal and the other end of the jumper wire is not conducted tothe other of the power source terminal and the second terminal, and theground terminal and the first terminal are conducted. Properties of theoutput signal are adjusted in an adjustment step. After the propertiesof the output signal are adjusted, the other of the power sourceterminal and the second terminal are conducted to the other end of thejumper wire in a connection step, so the second terminal and the powersource terminal are electrically connected via the jumper wire. Magneticfield strength, magnetic flux density, acceleration, angularacceleration, light strength (number of photons, optical power, incidentlight strength converted from the electric current value of electriccurrent generated by the photoelectric effect, or the like), ultrasonicwaves, pressure (value) or the like, for example, are included in thephysical quantities that can be detected by the physical quantitydetection element.

In the above-described sensor manufacturing method, preferably thecircuit board has a first surface and a second surface, which isopposite the first surface. A first through hole and a second throughhole, which penetrate in the thickness direction, are formed with aprescribed spacing in the circuit board. A first pad conducting to oneof the power source terminal and the second terminal is provided at theperiphery of the opening of the first through hole on the first surface,and a second pad conducting to the other is provided at the periphery ofthe opening of the second through hole on the second surface. One end ofthe jumper wire, which is roughly U-shaped, is inserted into the firstthrough hole. The first pad and the one end side of the jumper wire areelectrically connected. The other end of the jumper wire is insertedinto the second through hole. The second pad and the other end side ofthe jumper wire are not electrically connected.

In addition, in the above-described sensor manufacturing method, thesecond pad and the other end side of the jumper wire are preferablyelectrically connected in the connection step. The second pad ispreferably provided at a position separated in the radial direction fromthe opening periphery of the second through hole on the second surface.

In addition, the present invention provides a sensor intermediate partincludes a physical quantity detection element that has a power sourceterminal, a ground terminal and an output terminal, which outputs adesired output signal, where the physical quantity detection element iscapable of adjusting properties of the output signal; a high-capacitancecapacitor, which has at least a first terminal and a second terminal;and a jumper wire, one end of which is conducted to either the powersource terminal or the second terminal and the other end of which is notconducted. The first terminal is conducted to the power source terminal.The ground terminal and the second terminal are configured to beelectrically connectable via the jumper wire.

Effects of the Invention

With the present invention, it is possible to provide a sensorintermediate part in which the properties of the output signals can bestably adjusted without being affected by the capacitor, a sensorcapable of outputting signals with stable properties, and a method ofmanufacturing such.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a schematic configuration of asensor intermediate part according to one embodiment of the presentinvention.

FIG. 2 is a circuit diagram schematically showing the circuitconfiguration of the sensor intermediate part according to the oneembodiment of the present invention.

FIG. 3A is a schematic plan view showing a first surface side of acircuit board in the one embodiment of the present invention.

FIG. 3B is a schematic plan view showing a second surface side, which isopposite to the first surface of the circuit board shown in FIG. 3A.

FIG. 3C is a cross-sectional view schematically showing a schematicconfiguration of the circuit board shown in FIG. 3A.

FIG. 3D is an enlarged view of the portion surrounded by a broken lineof the circuit board shown in FIG. 3B.

FIG. 4 is a side view of the sensor intermediate part shown in FIG. 1.

FIG. 5 is a circuit diagram schematically showing the circuitconfiguration of a sensor according to the first embodiment of thepresent invention.

FIG. 6 is a cross-sectional view schematically showing the circuit boardof the sensor according to the one embodiment of the present invention.

FIG. 7 is a flowchart showing the steps of the method for manufacturingthe sensor according to the one embodiment of the present invention.

FIG. 8A is a cross-sectional end view schematically showing the stateprior to a jumper wire being passed through the through holes of thecircuit board, in the connection process shown in FIG. 7.

FIG. 8B is a cross-sectional end view schematically showing the stateafter the both ends of the jumper wire penetrate the through holes inthe circuit board and one end of the jumper wire is soldered to a firstsurface side of the circuit board, in the connection steps shown in FIG.7.

FIG. 8C is a cross-sectional end view schematically showing the state inwhich the other end of the jumper wire is soldered to a second surfaceside of the circuit board, in the connection steps shown in FIG. 7.

FIG. 8D is a cross-sectional end view schematically showing a connectionmethod with a jumper wire according to another embodiment of the presentinvention.

FIG. 9 is a circuit diagram schematically showing a circuitconfiguration of a sensor intermediate part according to anotherembodiment of the present invention.

MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the embodiments of the present invention will be describedwith reference to the drawings. The drawings are schematic orconceptual, and the dimensions of each members, the ratios of the sizesamong the members and the like are not necessarily the same as theactual members. In addition, even when representing the same member orthe like, there may be cases in which the dimensions and ratios of thedimensions are expressed differently in the drawings. In addition, inthe drawings attached to the Specification of the present invention, tofacilitate understanding, there are cases where the shapes, scale,vertical and horizontal dimensional ratios and the like are altered orexaggerated compared to the actual ones.

[Schematic Configuration of the Sensor Intermediate Part]

FIG. 1 is a perspective view showing a schematic configuration of asensor intermediate part according to one embodiment of the presentinvention. FIG. 2 is a circuit diagram schematically showing the circuitconfiguration in the sensor intermediate part according to the oneembodiment of the present invention. FIG. 3A is a schematic plan viewshowing a first surface side of a circuit board in the one embodiment ofthe present invention. FIG. 3B is a schematic plan view showing a secondsurface, which is opposite to the first surface of the circuit boardshown in FIG. 3A. FIG. 3C is a cross-sectional view schematicallyshowing a schematic configuration of the circuit board shown in FIG. 3A.FIG. 3D is an enlarged view of the portion surrounded by a broken lineof the circuit board shown in FIG. 3B. FIG. 4 is a side view of thesensor intermediate part shown in FIG. 1.

As shown in FIG. 1, the sensor intermediate part according to thisembodiment is an intermediate part 1 of an electric current sensor thatmeasures the input and output electric current flowing in a bus bar BB(see dashed line area) connected to the battery, to control the inputand output electric current and the like of the battery of a hybridelectric vehicle or the like, for example. The sensor intermediate part1 is provided with a circuit board 10 on which a below-describedmagnetic detection element 11 and a capacitor 12 are mounted, a roughlyrectangular housing 14 that holds the circuit board 10, a roughlyC-shaped magnetic core 15 having a prescribed gap, and a connector 16.

The housing 14 has a first housing 14 _(B) in which the circuit board 10is housed, and a second housing 14 _(C) that can cover the opening ofthe first housing 14 _(B). In the first housing 14 _(B) and the secondhousing 14 _(C), insertion holes 14 _(BH) and 14 _(CH), through which aflat-plate-shaped bus bar BB is inserted, are formed to be continuouswith each other in alignment. The magnetic core 15 is housed in thefirst housing 14 _(B) to surround the insertion hole 14 _(BH) (see FIG.1). As shown in FIG. 1, the insertion holes 14 _(BH) and 14 _(CH) havehole shapes through which the bus bar BB can be inserted, correspondingto the width (length in the short direction) and thickness of the busbar BB. The cross-sectional shape of the bus bar BB provided in thesensor intermediate part 1 in this embodiment is roughly rectangular,but this is intended to be illustrative and not limiting, and, forexample, the bus bar BB may be roughly circular or the like, and thecross-sectional area of the bus bar BB is not particularly limited,either. The hole shapes of the insertion holes 14 _(BH) and 14 _(CH) maybe appropriately set in accordance with the shape of the bus bar BB thatis inserted.

The circuit board 10 has a first surface 10 _(F) and a second surface 10_(R), which is opposite to the first surface 10 _(F), and the magneticdetection element 11 and the capacitor 12 (not shown in FIG. 1) arearranged on the first surface 10 _(F) side. The circuit board 10 isattached within the first housing 14 _(B) such that the magneticdetection element 11 arranged on the first surface 10 _(F) is positionedin the gap of the magnetic core 15. The connector 16 is provided on thesecond surface 10 _(B) side of the circuit board 10 and is fixed to thecircuit board 10 by screws 18.

In the circuit board 10, as described below, a first through hole 10_(H1) and a second through hole 10 _(H2) are formed, and one end 13 _(A)and the other end 13 _(B) of a roughly U-shaped jumper wire 13 arerespectively inserted into the first through hole 10 _(H1) and thesecond through hole 10 _(H2). As described below, a connector positionedon the one end 13 _(A) side of the jumper wire 13 is conducted to apower source terminal 11 _(VIN) of the magnetic detection element 11,but the connector positioned at the other end 13 _(B) side is notconducted to the capacitor 12.

The magnetic detection element 11 includes a magnetic sensor such as aHall's element or the like that outputs an output signal (outputvoltage) in response to a magnetic field generated by the input andoutput electric currents flowing in the bus bar BB, and a signalprocessing IC. An EEPROM or the like is housed in the signal processingIC as a memory part that stores adjustment parameters for adjusting theproperties of the output signal. As the magnetic detection element 11,one in which a signal processing IC and a Hall element such as aprogrammable IC are integrated, or one in which an MR element (AMRelement, GMR element or TMR element) and a signal processing IC arehybridized, or the like, may be used.

The sensor intermediate part 1 in this embodiment has a high-capacitancecapacitor 12. “High capacitance” in this embodiment means, for example,a capacitance that, when compared to a capacitor in which theelectrostatic capacitance in general is 0.1 μF or less, is larger thanthe capacitance of such, such as a bypass capacitor or the likepositioned on the circuit board for the purpose of removing or blockingnoise (that can be viewed as one type of alternating current) or thelike that causes erroneous operation of ICs by causing the voltage tofluctuate by mixing into the direct current flowing in the electroniccircuit. The electrostatic capacitance of the capacitor 12 in thisembodiment is preferably 1 μF or more, and more preferably 1˜100 μF,when it can be appropriately set in accordance with the impedance of thepower source system and the fall time of the power source voltage. Inaddition, in an electric current sensor produced from the sensorintermediate part 1 in this embodiment, in recent years miniaturizationhas been required in many cases, so from the perspective of controllingmounting space in the housing 14 (on the circuit board 10), using achip-type capacitor as the capacitor 12 is preferable.

The jumper wire 13 may be one in which a portion that conducts to thecapacitor 12 on the one end 13 _(A) side and a portion that conducts tothe power source terminal 11 _(VIN) of the magnetic detection element 11on the other end 13 _(B) side are exposed, and portions other than theseare covered by an insulator. The jumper wire 13 may be one in which theentirety is exposed (is not covered by an insulator).

The connector 16 has a connection terminal 16 _(T), and the connectionterminal 16 _(T) and each of the below-described terminals of themagnetic detection element 11 are connected via wiring (undepicted) onthe circuit board 10. When the properties of the output signal of themagnetic detection element 11 are adjusted in the sensor intermediatepart 1 in this embodiment, by connecting a programming device (notshown) to the connector 16, the magnetic detection element 11 and theprogramming device are connected via the connector 16, and a writesignal (programming signal) for adjusting the properties of the outputsignal from the below-described power source terminal 11 _(VIN) or asynchronization signal is input into the magnetic detection element 11.The connector 16 can function as the input unit for the write signal orthe synchronization signal in the sensor intermediate part 1, but theconnector 16 can function as the output unit for the output signaloutput from the magnetic detection element 11 in the electric currentsensor.

[Circuit Configuration of the Sensor Intermediate Part]

The circuit configuration of the sensor intermediate part 1 in thisembodiment will be described with reference to FIG. 2. The magneticdetection element 11 has a power source terminal 11 _(VIN), a groundterminal 11 _(GND) and an output terminal 11 _(VOT). The capacitor 12has a first terminal 12 _(A) and a second terminal 12 _(B). The jumperwire 13 has the one end 13 _(A) and the other end 13 _(B). As shown inFIG. 2, the first terminal 12 _(A) of the capacitor 12 is conducted tothe ground terminal 11 _(GND), and the connection part positioned on theone end 13 _(A) side of the jumper wire 13 is conducted to the powersource terminal 11 _(VIN), but the connection part positioned at theother end 13 _(B) side of the jumper wire 13 is not conducted to thesecond terminal 12 _(B) of the capacitor 12. That is, in the circuit ofthe sensor intermediate part 1, the capacitor 12 is not conducted to thepower source terminal 11 _(VIN). The sensor intermediate part 1 in thisembodiment is configured so that the power source terminal 11 _(VIN) andthe second terminal 12 _(B) can be electrically connected via the jumperwire 13. The circuit configuration is not limited to the one shown inFIG. 2. and the circuit configuration may be one in which the firstterminal 12 _(A) of the capacitor 12 is conducted to ground terminal 11_(GND), and the connection positioned at the other end 13 _(B) side ofthe jumper wire 13 is conducted to the second terminal 12 _(B) of thecapacitor 12, but the connection part positioned at the one end 13 _(A)side of the jumper wire 13 is not conducted to the power source terminal11 _(VIN).

In this embodiment, as noted above, the capacitor 12 is not conducted tothe power source terminal 11 _(VIN). Through this, it is possible toprevent the waveform of the write signal or the synchronization signalinput from the power source terminal 11 _(VIN) from being distorted bythe effects of the capacitor 12, so it is possible to adjust theproperties of the output signal output from the magnetic detectionelement 11 in the sensor intermediate part 1.

[Connection State of Jumper Wire]

Details of the connection state of the jumper wire 13 in this embodimentwill be described with reference to FIGS. 3A˜FIG. 3D. The first throughhole 10 _(H1) and the second through hole 10 _(H2), which penetrate inthe thickness direction of the circuit board, are formed in the circuitboard 10 with a prescribed spacing. In addition, a first pad 10 _(P1)conducting to the power source terminal 11 _(VIN) is arranged at theopening periphery of the first through hole 10 _(H1) on the firstsurface 10 _(F) side of the circuit board 10, and a second pad 10 _(P2)conducting to the second terminal 12 _(B) is arranged at the openingperiphery of the second through hole 10 _(H2) on the second surface 10_(R) side of the circuit board 10.

The one end 13 _(A) of the jumper wire 13 is inserted into the firstthrough hole 10 _(H1), and the connection positioned at the one end 13_(A) side of the jumper wire 13 is electrically connected by solder SLDto the first pad 10 _(P1) on the first surface 10 _(F) side of thecircuit board 10 (see FIG. 3A and FIG. 3C). On the other hand, the otherend 13 _(B) of the jumper wire 13 is inserted into the second throughhole 10 _(H2), but the connection part positioned at the other end 13_(B) side of the jumper wire 13 is not electrically connected to thesecond pad 10 _(P2) on the second surface 10 _(B) side of the circuitboard 10 (see FIG. 3B and FIG. 3C). The sensor intermediate part 1 inthis embodiment can be configured such that the power source terminal 11_(VIN) and the second terminal 12 _(B) can be electrically connected viathe jumper wire 13. The method of electrically connecting the one end 13_(A) side of the jumper wire 13 to the first pad 10 _(P1) is not limitedto soldering, and other commonly known methods can be used.

In this embodiment, as shown in FIG. 3C and FIG. 3D, the second pad 10_(P2) is provided at a position separated in the radial direction fromthe opening periphery of the second through hole 10 _(H2). Through this,while the other end 13 _(B) of the jumper wire 13 is inserted into thesecond through hole 10 _(H2), it is possible to prevent the connectionpart positioned at the other end 13 _(B) side from short-circuiting tothe second pad 10 _(P2). The distance in the radial direction betweenthe peripheral edge of the opening of the second through hole 10 _(H2)and the second pad 10 _(P2) may be set such that the connection partpositioned at the other end 13 _(B) side of the jumper wire 13 that haspenetrated the second through hole 10 _(H2) does not short-circuit tothe second pad 10 _(P2), and such that after adjusting the properties ofthe output signal of the magnetic detection element 11, the connectionpart positioned at the other end 13 _(B) side and the second pad 10_(P2) can be easily connected by soldering or the like.

In addition, as shown in the side view of FIG. 4, the first through hole10 _(H1) and the second through hole 10 _(H2) are formed in the circuitboard 10 such that the first pad 10 _(P1) (the first through hole 10_(H1)) and the second pad 10 _(P2) (the second through hole 10 _(H2))exist at positions protruding from the opening of the first housing 14_(B) when the circuit board 10 in the present invention is housed in thefirst housing 14 _(B). Through this, since the second pad 10 _(P2)exists at a position protruding from the opening of the first housing 14_(B), it is possible to easily connect the other end 13 _(B) of thejumper wire 13 to the second pad 10 _(P2) at the other end by solder orthe like. The above-described configuration is intended to beillustrative and not limiting. As long as the other end 13 _(B) of thejumper wire 13 can be easily connected by solder or the like to thesecond pad 10 _(P2), the second through hole 10 _(H2) may be formed inthe circuit board 10 to be positioned such that only the second pad 10_(P2) (the second through hole 10 _(H2)) protrudes from the opening ofthe first housing 14 _(B) when the circuit board 10 is housed in thefirst housing 14 _(B), for example. In addition, the second through hole10 _(H2) may be formed in the circuit board 10 such that when thecircuit board 10 is housed in the first housing 14 _(B), at least thesecond pad 10 _(P2) (the second through hole 10 _(H2)) is positionednear the opening of the first housing 14 _(B).

[Sensor]

FIG. 5 is a circuit diagram schematically showing the circuitconfiguration of the sensor according to one embodiment of the presentinvention, and FIG. 6 is a cross-sectional view schematically showingthe circuit board of the sensor according to one embodiment of thepresent invention. A sensor 1′ according to this embodiment can beconfigured such that the power source terminal 11 _(VIN) of theabove-described sensor intermediate part 1 and the second terminal 12_(B) of the capacitor 12 are electrically connected by the jumper wire13 (see FIG. 5). Specifically, while the other end 13 _(B) of the jumperwire 13 is inserted into the second through hole 10 _(H2), theconnection part positioned at the other end 13 _(B) side is electricallyconnected to the second pad 10 _(P2) by the solder SLD, and throughthis, the power source terminal 11 _(VIN) of the sensor intermediatepart 1 and the second terminal 12 _(B) of the capacitor 12 areelectrically connected by the jumper wire 13. As described above, in thestate of the sensor intermediate part 1, although the connectionpositioned at the first end 13 _(A) side of the jumper wire 13 isconducted to the power source terminal 11 _(VIN), the connection partpositioned at the other end 13 _(B) side of the jumper wire 13 is notconducted to the second terminal 12 _(B) of the capacitor 12. Inaddition, as described below, after the properties of the output signalof the magnetic detection element 11 have been adjusted in this state,the sensor 1′ in this embodiment is obtained by electrically connectingthe second terminal 12 _(B) of the capacitor 12 and the power sourceterminal 11 _(VIN) by the jumper wire 13. Consequently, it is possibleto output signals with stable properties according to the sensor 1′ ofthis embodiment.

[Sensor Manufacturing Method]

FIG. 7 is a flowchart showing steps for a method of manufacturing thesensor according to one embodiment of the present invention. FIG. 8A isa cross-sectional view schematically showing the state before the endsof the jumper wire are inserted into each of the through holes of thecircuit board, in the connection process shown in FIG. 7. FIG. 8B is across-sectional end view schematically showing the state after the twoends of the jumper wire are inserted into the through holes in thecircuit board and the one side of the jumper wire is soldered to thefirst surface side of the circuit board, in the connection steps shownin FIG. 7. FIG. 8C is a cross-sectional end view schematically showingthe state in which the other end of the jumper wire is soldered to thesecond surface side of the circuit board, in the connection steps shownin FIG. 7. FIG. 8D is a cross-sectional end view schematically showing aconnection method by the jumper wire according to another embodiment ofthe present invention.

[Circuit Board Preparation Step]

First, the circuit board 10, which is configured by paper phenol, glassepoxy or the like, for example, is prepared (step S1). The magneticdetection element 11, the output signal properties of which can beadjusted, and the capacitor 12 are mounted on the first surface 10 _(F)side of the circuit board 10. As described above, the magnetic detectionelement 11 has the power source terminal 11 _(VIN), the ground terminal11 _(GND) and the output terminal 11 _(VOT), and the capacitor 12 hasthe first terminal 12 _(A) and the second terminal 12 _(B) (see FIG. 2).The first terminal 12 _(A) of the capacitor 12 is conducted to theground terminal 11 _(GND). The first through hole 10 _(H1), whichpenetrates in the thickness direction and into which the first end 13_(A) of the roughly U-shaped jumper wire 13 can be inserted, and thesecond through hole 10 _(H2), which passes through in the thicknessdirection and into which the other end 13 _(B) can be inserted, areformed with a prescribed spacing in the circuit board 10 (see FIG. 8A).The first pad 10 _(P1) that conducts to the power source terminal 11_(VIN) is provided at the periphery of the opening of the first throughhole 10 _(F) on the first surface 10 _(F) of the circuit board 10, andthe second pad 10 _(P2) that conducts to the second terminal 12 _(B) isprovided at the periphery of the opening of the second through hole 10_(H2) on the second surface 10 _(R). The second pad 10 _(P2) is providedat a position separated in the radial direction from the openingperiphery of the second through hole 10 _(H2) on the second surface 10_(R). Through this, it is possible to prevent the connection positionedat the other end 13 _(B) side from short circuiting to the second pad 10_(P2), while the other end 13 _(B) of the jumper wire 13 has beeninserted into the second through hole 10 _(H2).

After the first end 13 _(A) of the jumper wire 13 is inserted into thefirst through hole 10 _(H1) and the other end 13 _(B) is inserted intothe second through hole 10 _(H2), the connection part positioned at thefirst end 13 _(A) side of the jumper wire 13 is electrically connectedto the first pad 10 _(P1) by soldering (see FIG. 8B). At this time, theconnection part positioned at the other end 13 _(B) side of the jumperwire 13 is not electrically connected to the second pad 10 _(P2) (seeFIG. 8B). The method of electrically connecting the connection partpositioned at the first end 13 _(A) side of the jumper wire 13 to thefirst pad 10 _(P1) is not limited to soldering, and anther commonlyknown connection method can be appropriately selected.

[Adjustment Step]

Next, the properties of the output signal of the magnetic detectionelement 11 are adjusted by connecting the magnetic detection element 11and the programming device (omitted from drawings) via the connector 16(see FIG. 1), and by inputting a write signal into the magneticdetection element 11 from the power source terminal 11 _(VIN) (step S2).The above description is intended to be illustrative and not limiting,and along with inputting a synchronization signal to the magneticdetection element 11 from the power source terminal 11 _(VIN) via theconnector 16, the properties of the output signal of the magneticdetection element 11 may be adjusted by inputting a write signal fromthe output terminal 11 _(VOT). In this embodiment, the capacitor 12 andthe power source terminal 11 _(VIN) are not electrically connected atthe time of adjusting the properties of the output signal, as describedabove, so it is possible to stably adjust the properties of the outputsignal without being affected by the capacitor 12.

[Connection Step]

Next, after the properties of the output signal have been adjusted, byelectrically connecting the connection part positioned at the other end13 _(B) side of the jumper wire 13 and the second pad 10 _(P2) bysoldering (see FIG. 8C), the second terminal 12 _(B) of the capacitor 12and the power source terminal 11 _(VIN) are electrically connected bythe jumper wire 13 (step S3). At this time, as described above, becausethe second pad 10 _(P2) (the second through hole 10 _(H2)) exists at aposition close to the opening of the housing 14 _(B) or protruding fromthis opening, work space for soldering is ensured, and the connectionwork can be performed easily. In addition, if the jumper wire 13 isfixed to the circuit board 10 in this connection step but not in thecircuit board preparation step, it is necessary to hold both ends of thejumper wire with hands, a jig or the like after inserting the two endsof the jumper wire 13 into the through holes, and the work becomescomplex. In contrast, in this embodiment, as described before, afterboth ends of the jumper wire 13 are inserted into the through holes inthe circuit board preparation step, the connection part positioned atthe one end 13 _(A) side is electrically connected to the first pad 10_(P1) by soldering, so the jumper wire 13 is fixed to the circuit board10 at the connection area. Hence, after the adjustment process, in thisconnection step, it is only necessary to electrically connect theconnection part positioned at the other end 13 _(B) side and the secondpad 10 _(P2) by soldering, so the connection work of the jumper wire 13can be easily performed. With the sensor manufacturing method of thisembodiment, it is possible to stably adjust the properties of the outputsignal of the magnetic detection element 11, without being affected bythe capacitor 12. In addition, the sensor 1′ manufactured by the sensormanufacturing method of this embodiment can work stably even if theoutput voltage instantaneously fluctuates due to noise or the like.

The above-described roughly U-shaped jumper wire 13 is intended to beillustrative and not limiting, and it would be acceptable to use abar-shaped jumper wire 13′ such as that shown in FIG. 8D, and afterelectrically connecting the one end side of the jumper wire 13′ and thefirst pad 10 _(P1) provided at the periphery of the opening of a throughhole 10 _(H3) on the first surface 10F of the circuit board 10, toadjust the properties of the output signal of the magnetic detectionelement 11 and then the second pad 10 _(P2) provided at the periphery ofthe opening of the through hole 10 _(H3) on the second surface 10 _(R)and the other end side of the jumper wire 13 may be electricallyconnected by soldering. In this case, at the connection portion of thebar-shaped jumper wire 13, due to differences in the coefficients ofthermal expansion between the circuit board 10 and the jumper wire 13,when the usage environment is exposed to high temperatures or lowtemperatures, thermal stress readily concentrates on the soldered areain the above-described connection portion. In contrast, with theabove-described roughly U-shaped jumper wire 13, even if the usageenvironment is exposed to high temperatures, for example, and thecircuit board 10 expands causing the circuit board 10 to deform in thedirection of thickness as a result, the roughly U-shaped jumper wire 13readily deforms in three dimensions (the width direction, the heightdirection and the depth direction) to follow the deformation of thecircuit board 10. By deforming the jumper wire 13 in the desired threedimensions, the thermal stress applied to the soldered portion isrelieved. As a result, concentration of thermal stress at the connectionportion of the jumper wire 13 is avoided, and it possible to furtherimprove the connection reliability (durability) of the soldered region.

With the sensor manufacturing method according to the above-describedembodiment, after the properties of the output signal of the magneticdetection element 11 are adjusted, the capacitor 12 is electricallyconnected to the power source terminal 11 _(VIN), so a sensor capable ofoutputting a signal with stable properties can be manufactured with highyield.

The above-described embodiment is presented to facilitate understand ofthe present invention and is not presented to limit the presentinvention. Accordingly, the various elements disclosed in theabove-described embodiment include all design modifications andequivalents falling within the technical scope of the present invention.

In the above-described embodiment, a circuit configuration of the sensorintermediate part 1 of the electric current sensor that measures theinput and output electric currents flowing in a conductor such as a busbar BB or the like using the magnetic detection element 11 was explainedas an example, and this is intended to be illustrative and not limiting.The circuit configuration of the sensor intermediate part 1 in thisembodiment can be also used as a circuit configuration in anintermediate part of an angular sensor that performs detection of therotational position of a rotating body such as a steering wheel or thelike in an automobile or the like, using the magnetic detection element11, for example. In addition, the present invention is not limited tothe circuit configuration of the intermediate part 1 of an electriccurrent sensor or the like that uses the magnetic detection element 11,and the circuit configuration of the sensor intermediate part 1 of thisembodiment can also be used as the circuit configuration of a sensorthat measures/determines the inclination of an object, the absence orpresence and movement of an object, the distance to an object, thepressure of a fluid or the like, using a prescribed physical quantitydetection element. As the physical quantity detection element used in asensor that measures/determines the inclination of an object, anacceleration detection element of semiconductor format (an electrostaticcapacitance detection format, a piezo-resistive format, a heat detectionformat or the like) that uses Micro Electro Mechanical System (MEMS)technology, an angular detection element such as a gyro sensor or thelike, a light detection element such as a photodiode or the like, anultrasonic wave detection element such as a piezoelectric element or thelike, or various types of pressure detection elements or the like can becited.

In addition, in this embodiment, after the output signal is adjusted,the connection positioned at the other end 13 _(B) side of the jumperwire 13 is electrically connected to the second pad 10 _(P2) provided atthe periphery of the opening of the second through hole 10 _(H2), so thecapacitor 12 and the power source terminal 11 _(VIN) of the magneticdetection element 11 are caused to conduct. On the other hand, insteadof this, a method can be conceived in which, without using the jumperwire 13, after the output signal is adjusted, the capacitor 12 ismounted on the circuit board 10. However, when the capacity of thehousing 14 and the mounting surface area of the circuit board 10 becomerelatively small to reduce the size of the sensor 1′, typically achip-type capacitor is used for convenience in mounting space. However,when mounting a relative small capacitor such as a chip-type capacitoron the circuit board 10 after the fact, mounting mistakes and the likeoccur, and a tiny capacitor is placed at the position where anothercircuit is mounted. Then, electrical defects such as short circuits inthe other circuit can arise. A sensor intermediate part in whichelectrical defects have occurred cannot be used in a product, so yieldsfall. On this point, in this embodiment, in the circuit board 10 onwhich the capacitor 12 has been mounted in advance, after the outputsignal of the magnetic detection element 11 is adjusted, the capacitor12 and the power source terminal 11 _(VIN) of the magnetic detectionelement are caused to conduct by the jumper wire 13, so it is possibleto prevent mounting mistakes and the like for tiny capacitors such aschip-type capacitors. As a result, it is possible to increase yields.

In addition, the circuit configuration in the circuit board 10 of thesensor intermediate part 1 of this embodiment is not limited to thecircuit configuration shown in FIG. 2 and may be a circuit configurationshown in FIG. 9. The circuit configuration shown in FIG. 9 is describedbelow. In FIG. 9, the same reference symbols are attached toconfigurations that are roughly the same as in the circuit configurationshown in FIG. 2, and detailed description of such is omitted here. Asshown in FIG. 9, the first terminal 12 _(A) of the capacitor 12 isconducted to the power source terminal 11 _(VIN), but the secondterminal 12 _(B) of the capacitor 12 is not conducted to the connectionpositioned at the other end 13 _(B) side of the jumper wire 13, and theconnection positioned at the one end 13 _(A) side of the jumper wire 13is conducted to the ground terminal 11 _(GND). That is, in the circuitof the sensor intermediate part 1 shown in FIG. 9, the capacitor 12 isnot conducted to the ground terminal 11 _(GND). The sensor intermediatepart 1 shown in FIG. 9 is configured so that the ground terminal 11_(GND) and the second terminal 12 _(B) can be electrically connected bythe jumper wire 13. The circuit configuration shown in FIG. 9 isintended to be illustrative and not limiting, and it would be fine tohave a circuit configuration in which the first terminal 12 _(A) of thecapacitor 12 is conducted to the power source terminal 11 _(VIN) and thesecond terminal 12 _(B) of the capacitor 12 is conducted to theconnection part positioned at the other end 13 _(B) side of the jumperwire 13, but the connection part positioned at the one end 13 _(A) sideof the jumper wire 13 is not conducted to the ground terminal 11 _(GND).

In the circuit configuration shown in FIG. 9, the capacitor 12 is notconducted to the ground terminal 11, as described above. Through this,it is possible to prevent the waveform of the write signal orsynchronization signal input from the power source terminal 11 _(VIN)from being deformed by the effects of the capacitor 12, so it ispossible to adjust the properties of the output signal output from themagnetic detection element 11 in the sensor intermediate part 1.

In the circuit board 10 having the circuit configuration shown in FIG. 9(see FIG. 3A˜FIG. 3D), the first pad 10 _(P1) may be conducted to theground terminal 11 _(GND) of the magnetic detection element 11. In thiscircuit board 10, the one end 13 _(A) of the jumper wire 13 is insertedinto the first through hole 10 _(H1), and the connection part positionedat the first end 13 _(A) side is electrically connected to the first pad10 _(P1) by the solder SLD. On the other hand, the other end 13 _(B) ofthe jumper wire 13 is inserted into the second through hole 10 _(H2),but the connection part positioned at the other end 13 _(B) side is notelectrically connected to the second pad 10 _(P2). In this manner, inthe circuit board 10 of the sensor intermediate part 1 having thecircuit configuration shown in FIG. 9, the ground terminal 11 _(GND) ofthe magnetic detection element 11 and the second terminal 12 _(B) of thecapacitor 12 can be configured to be electrically connectable via thejumper wire 13.

DESCRIPTION OF REFERENCE SYMBOLS

-   1 Sensor intermediate part-   10 Circuit board-   10 _(F) First surface-   10 _(R) Second surface-   10 _(H1) First through hole-   10 _(H2) Second through hole-   10 _(P1) First pad-   10 _(P2) Second pad-   11 Magnetic detection element-   11 _(VIN) Power source terminal-   11 _(GND) Ground terminal-   11 _(VOT) Output terminal-   12 Capacitor-   12 _(A) First terminal-   12 _(B) Second terminal-   13 Jumper wire-   13 _(A) One end-   13 _(B) Other end-   14 Housing-   14 _(B) First housing-   14 _(C) Second housing

1. A sensor intermediate part comprising: a physical quantity detectionelement that has a power source terminal, a ground terminal and anoutput terminal, which outputs a desired output signal, wherein thephysical quantity detection element is capable of adjusting propertiesof the output signal; a high-capacitance capacitor having at least afirst terminal and a second terminal; and a jumper wire, one end ofwhich is conducted to one of the power source terminal and the secondterminal and the other end of which is not conducted to the other of thepower source terminal and the second terminal; wherein the firstterminal is conducted to the ground terminal; and the power sourceterminal and the second terminal are configured to be electricallyconnectable by the jumper wire.
 2. The sensor intermediate partaccording to claim 1, further comprising: a circuit board having a firstsurface and a second surface, which is opposite to the first surface,wherein the physical quantity detection element and the capacitor arearranged on the first surface of the circuit board; a first through holeand a second through hole, which penetrate in the thickness direction ofthe circuit board and which are formed with a prescribed spacing in thecircuit board; and a first pad, which can be conducted to one of thepower source terminal and the second terminal, arranged at the peripheryof the opening of the first through hole on the first surface, and asecond pad, which can be conducted to the other of the power sourceterminal and the second terminal, arranged at the periphery of theopening of the second through hole on the second surface; wherein oneend of the jumper wire, which is roughly U-shaped, is inserted into thefirst through hole and the one end of the jumper wire is electricallyconnected to the first pad on the first surface side; and the other endof the jumper wire is inserted into the second through hole and theother end of the jumper wire is not electrically connected to the secondpad on the second surface.
 3. The sensor intermediate part according toclaim 2, wherein the second pad is provided at a position separated inthe radial direction from the opening periphery of the second throughhole on the second surface.
 4. The sensor intermediate part according toclaim 2, further comprising a housing that holds the circuit board;wherein the housing includes a first housing and a second housing thatcovers an opening of the first housing; and the second through hole isformed in the circuit board such that at least the second pad exists ata position close to the opening of the first housing or protruding fromthe opening when the circuit board is held in the first housing.
 5. Thesensor intermediate part according to claim 1, wherein the capacitor hasa capacitance of 1 μF or more.
 6. A sensor, wherein the power sourceterminal and the second terminal of the sensor intermediate partaccording to claim 1 are electrically connected by the jumper wire.
 7. Asensor manufacturing method, including: a preparation step wherein acircuit board is prepared on which are mounted a physical quantitydetection element, which has a power source terminal, a ground terminal,an output terminal, which outputs a desired output signal, whereinproperties of the output signal are adjustable, and a capacitor havingat least a first terminal and a second terminal, one end of a jumperwire is conducted to one of the power source terminal and the secondterminal, and the other end of the jumper wire is not conducted to theother of the power source terminal and the second terminal, and theground terminal and the first terminal are conducted; an adjustment stepwherein properties of the output signal are adjusted; and a connectionstep wherein after the properties of the output signal have beenadjusted, the other of the power source terminal and the second terminalare conducted to the other end of the jumper wire, so the secondterminal and the power source terminal are electrically connected by thejumper wire.
 8. The sensor manufacturing method according to claim 7,wherein: the circuit board has a first surface and a second surface,which is opposite to the first surface; a first through hole and asecond through hole, which penetrate in the thickness direction, areformed with a prescribed spacing in the circuit board; a first padconducting to one of the power source terminal and the second terminalis provided at the periphery of the opening of the first through hole onthe first surface, and a second pad conducting to the other is providedat the periphery of the opening of the second through hole on the secondsurface; one end of the jumper wire, which roughly U-shaped, is insertedinto the first through hole, and the first pad and the one end side ofthe jumper wire are electrically connected; and the other end of thejumper wire is inserted into the second through hole, and the second padand the other end side of the jumper wire are not electricallyconnected.
 9. The sensor manufacturing method according to claim 8,wherein in the connection step, the second pad and the other end side ofthe jumper wire are electrically connected.
 10. The sensor manufacturingmethod according to claim 8, wherein the second pad is provided at aposition separated in the radial direction from the opening periphery ofthe second through hole on the second surface.
 11. A sensor intermediatepart comprising: a physical quantity detection element that has a powersource terminal, a ground terminal and an output terminal, which outputsa desired output signal, wherein the physical quantity detection elementis capable of adjusting properties of the output signal; ahigh-capacitance capacitor, which has at least a first terminal and asecond terminal; and a jumper wire, one end of which is conducted to oneof the ground terminal and the second terminal and the other end ofwhich is not conducted to the other of the ground terminal and thesecond terminal; wherein the first terminal is conducted to the powersource terminal; and the ground terminal and the second terminal areconfigured to be electrically connectable by the jumper wire.